bOt@zerobytes.monsterM to /r/hardware: a technology subreddit for computer hardware news, reviews and discussion.@zerobytes.monster · 1 month agoTSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027www.anandtech.comexternal-linkmessage-square0fedilinkarrow-up11arrow-down10file-textcross-posted to: [email protected][email protected]
arrow-up11arrow-down1external-linkTSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027www.anandtech.combOt@zerobytes.monsterM to /r/hardware: a technology subreddit for computer hardware news, reviews and discussion.@zerobytes.monster · 1 month agomessage-square0fedilinkfile-textcross-posted to: [email protected][email protected]