The original post: /r/hardware by /u/TwelveSilverSwords on 2024-09-28 07:20:18.
https://x.com/QaM_Section31/status/1839851837526290664
The total die area is 169.6 mm². CPU cluster is 48 mm² and GPU cluster is 24 mm². A single Oryon core is 2.55 mm². It’s made on TSMC’s 4nm process node.
SoC | Node | Die area | Core area |
---|---|---|---|
Snapdragon X Elite | N4P | 169.6 mm² | Oryon - 2.55 mm² |
Apple M4 | N3E | 165.9 mm² | P-core = 2.97 mm² |
Apple M3 | N3B | 146 mm² | P-core = 2.49 mm² |
Apple M2 | N5P | 151 mm² | P-core = 2.76 mm² |
Apple M1 | N5 | 118 mm² | P-core = 2.28 mm² |
AMD Phoenix | N4 | 178 mm² | Zen4 = 3.84 mm² |
AMD Strix Point | N4P | 232 mm² | Zen5 = 4.15 mm², Zen5C = 3.09 mm² |
Meteor Lake | Intel 4 | - | Redwood Cove = 5.05 mm² |
If anybody has more die area/core area figures, please submit them in the comments section below, so I can add them to the above comparison table.
Note: For the Core Area numbers, I have included only private caches. Shared caches have been excluded.
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